Morphology Behavior of Copper Films Deposited after Wet Surface Treatment on Polished Alumina

In this paper, a pre-treatment process for electroless copper (Cu) deposition on the polished alumina (Al2O3) 99.9% and the behavior of Cu plating by electroless process after Al2O3 surface treatment were explored. Our work was carried out by changing the roughness of Al2O3 through micro-etching (coarsening), nucleation its surface by a two-step method (sensitization and activation) and electroless Cu plating deposited using non-commercial solution having formaldehyde as reducer, alkaline pH and operating temperature of 30 ºC. Contact angle system (CA), scanning electron microscopy (SEM), ene...

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