Nano Coated Lead Free Solders for Sustainable Electronic Waste Management

AUTOR(ES)

Geethan, K. Arun Vasantha, Jose, S., Kannan, S. Ashwin, Durai Raj, J. Immanuel, k., Ramesh

FONTE

Braz. arch. biol. technol.

DATA DE PUBLICAÇÃO

23/01/2017

RESUMO

ABSTRACT Lead has been used in a wide range of applications, but in the past decades it became clear that its high toxicity could cause various problems. Studies indicate that exposure to high concentrations of lead can cause harmful damages to humans. To eliminate the usage of lead in electronic products as an initiative towards electronic waste management (e waste), lead free solders were produced with suitable methods by replacing lead. But lead free solders are not preferred as a substitute of lead because they are poor in their mechanical properties such as tensile strength, shear strength and hardness which are ultimately required for a material to resist failure.Nano-Structured materials and coatings offer the potential for Vital improvements in engineering properties based on improvements in physical and mechanical properties resulting from reducing micro structural features by factors of 100 to 1000 times compared to current engineering materials.

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